pb lead-free parts LBD201SBKS-XX-PF data sheet doc. no : qw0905-LBD201SBKS-XX-PF rev. : a date : 09 - sep. - 2008 ligitek electronics co.,ltd. property of ligitek only light bar led display
page1/7 6.35(0.25") 8.0(0.315") LBD201SBKS-XX-PF 2.54x2=5.08 (0.2") 7.49(0.295") 5.08(0.2") 4.3 0.5 ? 0.45 typ 12.7 (0.5") 13.97 (0.55") ligitek electronics co.,ltd. property of ligitek only part no. package dimensions note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. LBD201SBKS-XX-PF ligitek pin no.1 pin 1 pin 3 pin 4 pin 6
part no.LBD201SBKS-XX-PF page2/7 np cathode 6 1 LBD201SBKS-XX-PF 2 1 internal circuit diagram LBD201SBKS-XX-PF ligitek electronics co.,ltd. property of ligitek only pin no. electrical connection 3 4 3 4 anode cathode 5 6 nc anode
-25 ~ +85 tstg storage temperature note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. d ( nm) 460 part selection and application information(ratings at 25) ingan/sic material LBD201SBKS-XX-PF part no common cathode bule common cathode or anode emitted chip electrical max. 3.5 264.2 typ. (nm) vf(v) 2:1 6.18.5 iv-m min. typ. iv(mcd) peak forward current per chip (duty 1/10,0.1ms pulse width) power dissipation per chip operating temperature reverse current per any chip t opr pd ir forward current per chip parameter i fp i f symbol -20 ~ +80 120 50 a mw 100 30 ratings sbks ma ma unit ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 page 3/7 v 500 esd electrostatic discharge( * ) static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LBD201SBKS-XX-PF
symbol iv-m spectral line half-width reverse current any chip luminous intensity matching ratio parameter luminous intensity per chip dominant wavelength forward voltage per chip ir a nm vr=5v if=20ma iv d vf mcd nm volt unit if=10ma if=20ma if=20ma test condition test condition for each parameter ligitek electronics co.,ltd. property of ligitek only page4/7 part no. LBD201SBKS-XX-PF
5/7 page ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve 2 15 4 3 0 fig.4 relative intensity vs. wavelength forward current(ma) f o r w a r d c u r r e n t @ 2 0 m a r e l a t i v e i n t e n s i t y @ 2 0 m a ambient temperature( ) 0 0 10 2550100 75 430 380 0 fig.3 forward current vs. temperature forward voltage(v) 20 30 40 0.5 1.0 05 530 480 480 580 wavelength (nm) 680 630 15 1020 30 25 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) 25 0 5 10 15 20 sbk-s chip 30 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.25 0.25 0.5 1.0 0.75 1.5 part no. LBD201SBKS-XX-PF
page 6/7 ligitek electronics co.,ltd. property of ligitek only time(sec) 150 260 c3sec max 5 /sec max 100 2 /sec max preheat 50 260 temp( c) 120 0 25 0 60 seconds max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. part no. LBD201SBKS-XX-PF
7/7 page reference standard jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 description reliability test: test itemtest condition the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. low temperature storage test high temperature storage test solder resistance test high temperature high humidity test thermal shock test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. part no. LBD201SBKS-XX-PF
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